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Samsung’s New Semiconductor Fabrication Plant in 2017: Growing Demand for Advanced Semiconductor Products for Electronics Including Digital Still / Video Cameras

A semiconductor product (a.k.a. “chips” or “semis”) is the “final or intermediate form of an incorporated circuit in a chip. It has an electronic function.”

Samsung will construct a new semiconductor fabrication plant in the company’s Godeok Industrial Complex in Pyeongtaek, South Korea.

Samsung’s Memory Business offers the industry’s most advanced and extensive range of memory semiconductor products. As a leader in both the design and manufacture of memory semiconductor since 1993, the business provides key memory products including dynamic random access memory (DRAM), static random access memory (SRAM), NAND flash memory, Solid State Drives (SSD) and a range of green memory solutions for use in PC, server and mobile applications. Samsung is also leading the industry in advancements of next generation DRAM and NAND flash technologies while nurturing future memory technologies.

Samsung’s System LSI Business designs and manufactures a variety of large scale integrated circuit (LSI) products….Samsung is a leading provider of CMOS image sensors for use in mobile phones, digital still cameras, DSLR cameras, digital video cameras and camera embedded display. Samsung’s leadership in this area includes backside illumination sensor technology, which dramatically enhances the light sensitivity of a sensor, and helps offering clear and crisp image quality. Samsung’s imagers also have advantages in high resolution, fast motion playback and longer battery life.

Samsung’s LED Business aims to achieve excellence as a long life, energy saving and eco-friendly light source supplier in displays and lighting applications. Samsung’s advanced semiconductor manufacturing expertise serves as a strong foundation to deliver state-of-the-art LED devices. Samsung offers LED based lighting solutions in the form of back light units in display panels, exterior and dashboard lighting in automotives, lighting packages and engines with and without integrated optics, and drivers and retrofit lighting such as bulbs and tubes.

The Memory and System LSI products are fabricated in the wafer fabrication (front-end) production facilities that are located in Giheung and Hwaseong, Korea (near Seoul), and in Austin, Texas. The company also operates IC (Integrated Circuit) assembly and testing plants in Onyang, Korea and Suzhou, China. A key benefit of Samsung’s component strategy is operational efficiencies of placing manufacturing facilities and R&D offices on the same plant helps the company create distinctive synergy effect in the industry, while fertilizing communication more efficient and timely.

Samsung is also operating wafer level LED production within the main semiconductor locations in Giheung and Hwaseong, Korea and a package assembly site in Tianjin, China. As a means to secure supplies of core materials, a vertically integrated structure for phosphor and sapphire wafers is formed through a joint venture with Sumitomo Chemicals.

http://www.samsung.com/global/business/semiconductor/aboutus/business/overview

http://www.samsung.com/global/business/semiconductor/aboutus/business/factsheet

The latest high-end digital still/video cameras offer multiple advantages, such as “an ultra-compact physical size, ease of use, exceptional image quality, and long battery life.”

Samsung’s comprehensive range of DRAM solutions is Dynamic memory for today’s consumer electronics, including digital still cameras, video cameras and many other devices.

Samsung Consumer DRAM. The figure illustrates different DRAM characteristics required by typical appliances and applications in home use today. Image by Samsung.

Samsung Consumer DRAM delivers state-of-the art solutions for a wide range of consumer device and application requirements, including the following:

Samsung’s leading LSI products include CMOS image sensors (CIS), display driver IC (DDI), smart card IC, microcontroller units (MCU) and near field communication (NFC) IC .

Samsung Tomorrow

NEWS RELEASE

Samsung Electronics Signs Agreement to Construct
New Semiconductor Fabrication Plant in Korea

October 6, 2014

Samsung Electronics held a signing ceremony  for a memorandum of understanding (MOU) to construct a new semiconductor fabrication plant in the company’s Godeok Industrial Complex in Pyeongtaek. The local authorities, representing the provincial and municipal governments of Gyeonggi Province, agreed to cooperate with Samsung in the construction and operation of the new fabrication plant, as well as to provide assistance in preparing the requisite infrastructure.

Pyeongtaek. Image by Samsung Tomorrow. Image by Samsung.

“Our investment into the new fabrication plant will significantly influence the shaping of Samsung’s future semiconductor business,” said Dr. Oh-Hyun Kwon, CEO and Vice Chairman of Samsung Electronics, who attended the ceremony. “We sincerely thank Gyeonggi Province and Pyeongtaek for their full support.”

Samsung Electronics Signs Agreement to Construct New Semiconductor Fabrication Plant in Korea. Image by Samsung

Construction on the 790,000m2 site will begin during the first half of 2015, and operations are scheduled to begin sometime during the second half of 2017. Samsung will invest approximately KRW 15.6 trillion. The new fabrication plant is expected to help Samsung meet growing demand for advanced semiconductor products, while also further solidifying the company’s global presence and market leadership by realizing its vision for a globally balanced semiconductor fabrication network.

Dignitaries attending the ceremony included Kyung-pil Nam, Governor of Gyeonggi Province, Jae Kwang Kong, Mayor of Pyeongtaek City, and Keum Sik Choi, CEO of Gyeonggi Urban Innovation Corporation.

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